IEC 62258-6-2006 半导体压模产品.第6部分:关于热模拟的信息要求
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【英文标准名称】:Semiconductordieproducts-Part6:Requirementsforinformationconcerningthermalsimulation
【原文标准名称】:半导体压模产品.第6部分:关于热模拟的信息要求
【标准号】:IEC62258-6-2006
【标准状态】:现行
【国别】:国际
【发布日期】:2006-08
【实施或试行日期】:
【发布单位】:国际电工委员会(IX-IEC)
【起草单位】:IEC/TC47
【标准类型】:()
【标准水平】:()
【中文主题词】:组装件;特性;芯片;组件;连接;交付;电气工程;电学测量;电子工程;电子设备及元件;集成电路;材料;机械试验;采办;生产;半导体器件;半导体;模拟;仿真摸型;规范(验收);试验;热的;薄片
【英文主题词】:Assemblies;Behaviour;Chips;Components;Connections;Delivery;Electricalengineering;Electricalmeasurement;Electronicengineering;Electronicequipmentandcomponents;Integratedcircuits;Materials;Mechanicaltesting;Procurements;Production;Semiconductordevices;Semiconductors;Simulation;Simulationmodel;Specification(approval);Testing;Thermal;Wafers
【摘要】:ThispartofIEC62258hasbeendevelopedtofacilitatetheproduction,supplyanduseofsemiconductordieproducts,including:?wafers;?singulatedbaredie;?dieandwaferswithattachedconnectionstructures;?minimallyorpartiallyencapsulateddieandwafers.ThispartofIEC62258determinestheinformationrequiredtofacilitatetheuseofthermaldataandmodelsforsimulationofthethermalbehaviourandverificationofthecorrectfunctionalityofelectronicsystemsthatincludebaresemiconductordie,withorwithoutconnectionstructures,and/orminimallypackagedsemiconductordie.ItisintendedtoassistallthoseinvolvedinthesupplychainfordiedevicestocomplywiththerequirementsofIEC62258-1andIEC62258-2.
【中国标准分类号】:L57
【国际标准分类号】:31_080_99;31_200
【页数】:9P.;A4
【正文语种】:英语
【原文标准名称】:半导体压模产品.第6部分:关于热模拟的信息要求
【标准号】:IEC62258-6-2006
【标准状态】:现行
【国别】:国际
【发布日期】:2006-08
【实施或试行日期】:
【发布单位】:国际电工委员会(IX-IEC)
【起草单位】:IEC/TC47
【标准类型】:()
【标准水平】:()
【中文主题词】:组装件;特性;芯片;组件;连接;交付;电气工程;电学测量;电子工程;电子设备及元件;集成电路;材料;机械试验;采办;生产;半导体器件;半导体;模拟;仿真摸型;规范(验收);试验;热的;薄片
【英文主题词】:Assemblies;Behaviour;Chips;Components;Connections;Delivery;Electricalengineering;Electricalmeasurement;Electronicengineering;Electronicequipmentandcomponents;Integratedcircuits;Materials;Mechanicaltesting;Procurements;Production;Semiconductordevices;Semiconductors;Simulation;Simulationmodel;Specification(approval);Testing;Thermal;Wafers
【摘要】:ThispartofIEC62258hasbeendevelopedtofacilitatetheproduction,supplyanduseofsemiconductordieproducts,including:?wafers;?singulatedbaredie;?dieandwaferswithattachedconnectionstructures;?minimallyorpartiallyencapsulateddieandwafers.ThispartofIEC62258determinestheinformationrequiredtofacilitatetheuseofthermaldataandmodelsforsimulationofthethermalbehaviourandverificationofthecorrectfunctionalityofelectronicsystemsthatincludebaresemiconductordie,withorwithoutconnectionstructures,and/orminimallypackagedsemiconductordie.ItisintendedtoassistallthoseinvolvedinthesupplychainfordiedevicestocomplywiththerequirementsofIEC62258-1andIEC62258-2.
【中国标准分类号】:L57
【国际标准分类号】:31_080_99;31_200
【页数】:9P.;A4
【正文语种】:英语
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